A recent leak suggests that Apple’s next-generation M5 series chips, including the M5 Pro, M5 Max, and M5 Ultra, will soon feature a revolutionary chip architecture. This technology is called SoIC-MH (System-on-Integrated-Chips – Molding Horizontal), developed by TSMC. SoIC-MH is essentially a 2.5D packaging technology capable of combining multiple small chiplets into a single package. This means that the CPU, GPU, and other processing units will now be integrated onto a single silicon chip, not as a “monolithic chip,” but as a modular system. Let’s explore how the future of Apple Silicon will change and whether this will truly be a new era for Apple Silicon.
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What is SoIC-MH Technology?
Apple’s SoIC-MH represents a new step in semiconductor design. It connects several smaller “chiplets” horizontally within the same package, allowing for modular and scalable configurations. Here are the key aspects:
- Multi-Chip Integration: Instead of a single large chip, several smaller chiplets will be connected horizontally. This will provide greater flexibility in chip design and allow for independent upgrades of individual components.
- Separated CPU and GPU Design: According to this leak, Apple’s M5 series will have a separate CPU and GPU, allowing them to be tuned for their specific tasks. This will also improve thermal efficiency. This means that devices like the new MacBook and Mac Studio will be able to run at higher speeds for longer.
- Improved Performance and Energy Efficiency: If we get SoIC-MH technology in Apple’s new chip, M5, the chip will be able to dissipate heat better. This allows the chips to run at higher clock speeds for longer periods of time without overheating. This improves both battery performance and device stability.
- Higher Manufacturing Yield: Using multiple smaller chiplets has been shown to reduce the likelihood of defects during production. This also reduces costs and allows Apple to achieve better production rates, meaning new Macs can be launched more quickly.
I’m a Mac user, and if this technology is implemented in Apple’s new chips, it will involve multiple smaller chiplets being connected horizontally instead of a single large monolithic chip. This means that Apple’s CPU and GPU will no longer be forced to fit on a single silicon die.
SEE ALSO: iPad Pro M5 vs M4: Real Upgrade or Just a Refresh?
Instead, they can be designed and assembled as separate modules. Consequently, if Mac users use software or applications that require more CPU or GPU usage, they will be able to customize the software to suit the hardware. This will result in next-level performance. So, let’s learn more about it:
M5 Pro and M5 Max: True Modular Power
It’s worth noting that SoIC-MH will now allow Apple to design its Pro and Max chips in “Custom Modular Blocks.” For example, the CPU blocks in a Mac Studio or MacBook Pro can be configured with more cores, while keeping the GPU relatively low. Or conversely, the GPU can be doubled for AI/Graphics-intensive workloads. This will give Apple a new degree of control. Furthermore, it will allow for different performance classes to be created from the same base architecture, without having to redesign the entire chip. Now it remains to be seen what else we will see in the M5 chip.
Built on TSMC’s Advanced 3nm “N3P” Process
According to a recent report from TweakTown, the M5 Pro and M5 Max chips will be built on TSMC’s 3nm “N3P” process. This is considered more efficient and powerful than the N3E process used in the current M4 chips. This will not only improve performance but also significantly increase power efficiency. Let’s take a look at the M5 models that could use SoIC-MH technology.
Expected M5 Lineup and Technology Adoption
| Model | SoIC-MH Packaging | Process node | Estimated Launch Timeline |
|---|---|---|---|
| M5 (Base) | No | TSMC N3E | 2025 (early Mac) |
| M5 Pro | Yes | TSMC N3P | Second half of 2026 |
| M5 Max | Yes | TSMC N3P | Second half of 2026 |
| M5 Ultra | Yes (Advanced Version) | TSMC N3P | 2026 |
Why not all models?
Multiple reports have clarified that the SoIC-MH packaging will be limited to the Pro, Max, and Ultra variants. The base M5 chip, meant for mainstream products like the MacBook Air or iMac, will continue to use a traditional monolithic design. This will allow Apple to control costs and offer a premium experience to high-end users.
Production Challenges and Possible Delays M5
It’s not easy for Apple to implement a new packaging technology like SoIC-MH on a large scale. TweakTown reports that Apple and TSMC may take until 2026 to stabilize the design and prepare it for mass production. This means the M5 Ultra’s launch is likely to be delayed in 2026. It’s possible, but there are reports that Apple may announce an event as early as October. Now, it remains to be seen whether it launches the M5 (base) model or if we’ll have to wait longer.
Final Verdict
Apple’s final move to a SoIC-MH modular chip design could prove to be one of the most significant changes in Apple Silicon’s history. With a combination of modular scalability, improved heat capacity, and enhanced scale, the M5 Pro and M5 Max could change the meaning of “pro” for the Mac lineup.
If successful, Apple’s modular chip future will not only accelerate speed but also fundamentally change the way Mac devices are developed in the years to come. What do you think about this new technology, and why has the M5 not been released yet? Let us know your thoughts in the comments.
SEE ALSO: MacBook Pro And Mac Mini with M5 Power: What’s New in Apple’s Next Big Update
